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SULFURIC ACID TIN PLATING BATH FOR REFLOW PLATING CAPABLE OF EMBODYING FAST CONTINUOUS PLATING
SULFURIC ACID TIN PLATING BATH FOR REFLOW PLATING CAPABLE OF EMBODYING FAST CONTINUOUS PLATING
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机译:用于快速连续电镀的回流电镀能力的硫酸锡电镀浴
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摘要
PURPOSE: To improve the stability of a bath and carry out fast and continuous plating by allowing ferrous sulfate to coexist in a tin plating bath, and reducing oxide of Sn ion in the bath. ;CONSTITUTION: This sulfuric acid tin plating bath for reflow plating has a compsn. of 50-150g/l tin sulfate and 0.1-10g/l ferrous sulfate. Fe2+ ion of ferrous sulfate reduces oxide of Sn2+ ion to prevent production of oxide (SnO2). Thus, a white turbid state of the plating bath and production of sludge can be prevented.;COPYRIGHT: (C)1995,JPO
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