POST DEVICE MANUFACTURING METHOD FOR MICROWAVE INTEGRATED CIRCUIT AND MANUFACTURING METHOD FOR MICROWAVE CIRCUIT DEVICE INCLUDING IT

摘要

PROBLEM TO BE SOLVED: To improve an electric characteristic and a microwave transmission characteristic by providing a substrate with a cover layer, performing anisotropic etching so as to pierce though a desired position, performing gold plating at a desired position to form posts, eliminating the cover layer and exposing the posts. ;SOLUTION: One surface of a substrate 14 is provided with a cover layer. Next, photo resist is formed on the cover layer to expose a desired position to be demarcated. Anisotropic etching is performed so as to pierce through a fixedly desired position of the substrate 14. Then, a photo resist layer is eliminated, Gold plating is performed on a desired position to form posts 28. Lapping by mechanical grinding is applied so that the cover layer and the tops of the posts may become almost flat. Next, the cover layer is eliminated and the posts 28 are exposed.;COPYRIGHT: (C)1996,JPO