首页> 外国专利> PRINTED SHEET HAVING PROCESSING LINE FORMED THEREON AND USED FOR ADHESION AND FORMATION OF PROCESSING LINE

PRINTED SHEET HAVING PROCESSING LINE FORMED THEREON AND USED FOR ADHESION AND FORMATION OF PROCESSING LINE

机译:印有加工线的锻造加工线,用于粘合和加工线的形成

摘要

PROBLEM TO BE SOLVED: To obtain a printed sheet for adhesion, good in its cutting or folding on processing lines and not causing such the clogging of an adhesive or the adhesion of cut burrs to perforated holes, cut parts, half-cut grooves, etc., as in a conventional adhesion printed sheet in which an adhesive layer inactive in the ordinary state is disposed on the surface of the substrate, and further to provide a method for forming processing lines, capable of arbitrarily, selectively and easily forming the processing lines such as perforated lines, cut lines, half-cut lines, etc., without using such exclusive processing tools in response to the kinds of the processing lines as in a conventional method for forming the processing lines. ;SOLUTION: This printed sheet 1 for adhesion comprises a sheet substrate 2 and an adhesive layer 3 disposed in a prescribed part of the surface of the sheet substrate 2 and inactive in the ordinary state, and has prescribed processing lines 4 such as perforated lines, cut lines or half-cut lines formed by irradiating the sheet substrate 2 having the adhesive layer 3 with a laser to evaporate off the adhesive layer 3 and sheet substrate 2 in the laser-irradiated parts.;COPYRIGHT: (C)1997,JPO
机译:解决的问题:要获得印刷用纸的粘附力,其在加工线上的切割或折叠性能良好,并且不会造成粘合剂的堵塞或切口毛刺对穿孔,切口部分,半切槽等的粘附,如在常规粘合印刷片材中那样,将在常态下不活泼的粘合剂层设置在基板的表面上,并且还提供了一种用于形成加工线的方法,该方法能够任意,选择性和容易地形成加工线。诸如穿孔线,切割线,半切割线等,而不像传统的形成加工线的方法那样响应于加工线的种类而使用这种专用加工工具。 ;解决方案:该用于粘合的印刷片材1包括片材基底2和设置在片材基底2的表面的规定部分中并且在正常状态下不起作用的粘合剂层3,并且具有规定的加工线4,例如穿孔线,切割线或半切割线是通过用激光照射具有粘合剂层3的片状基片2以蒸发掉激光照射部分中的粘合剂层3和片状基片2而形成的。COPYRIGHT:(C)1997,JPO

著录项

  • 公开/公告号JPH09268273A

    专利类型

  • 公开/公告日1997-10-14

    原文格式PDF

  • 申请/专利权人 TOPPAN MOORE CO LTD;

    申请/专利号JP19960103305

  • 申请日1996-03-29

  • 分类号C09J7/02;C09J7/02;

  • 国家 JP

  • 入库时间 2022-08-22 03:36:38

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