首页> 外国专利> WATER CULTURE OF PLANT WITH ITS CUTTING AND DEVICE FOR WATER CULTURE OF PLANT WITH CUTTING AND SUPPORT OF CUTTING OF PLANT ON WATER CULTURE AND CUTTING OF PLANT ON WATER CULTURE

WATER CULTURE OF PLANT WITH ITS CUTTING AND DEVICE FOR WATER CULTURE OF PLANT WITH CUTTING AND SUPPORT OF CUTTING OF PLANT ON WATER CULTURE AND CUTTING OF PLANT ON WATER CULTURE

机译:植物的水分培养及其切割装置及植物的切割和水分切割的支持植物和水的切割植物的支持。

摘要

PROBLEM TO BE SOLVED: To culture the cutting of a plant by supporting the cutting with a supporter and floating the supported cutting on water suitable for water culture. SOLUTION: A method for water-culturing the one or plural cuttings of a plant comprises supporting the cuttings of the plant suitable for the water culture with a supporter, disposing water suitable for the water culture below the supporter for the cuttings, and culturing the cuttings by the water culture method, and enables the rooting and germination of the cuttings without using a culture soil. A device for water-culturing the cuttings. A method for supporting the cuttings of the plant on the water culture. And the cutting for the water culture method.
机译:要解决的问题:通过用支撑物支撑切割物并将支撑的切割物漂浮在适于水培养的水上,来培养植物的切割物。解决方案:一种用于对一个或多个植物插条进行水培养的方法,该方法包括用支撑物支撑适合于水培养的植物的插条,将适合水培养的水放置在用于插条的支撑物下方,然后对插条进行培养。通过水培养方法,可以使插条生根和发芽,而无需使用培养土。一种用于水培切屑的装置。一种在水培上支持植物插条的方法。并为水培切割法。

著录项

  • 公开/公告号JPH0956282A

    专利类型

  • 公开/公告日1997-03-04

    原文格式PDF

  • 申请/专利权人 KOBAYASHI HIDETOSHI;

    申请/专利号JP19950245029

  • 发明设计人 KOBAYASHI HIDETOSHI;

    申请日1995-08-21

  • 分类号A01G31/00;A01G1/00;A01G31/04;

  • 国家 JP

  • 入库时间 2022-08-22 03:32:47

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