Production manner null of zigzag inline die mojiyu - ru and zigzag inline die mojiyu -

摘要

PURPOSE:To eliminate a folding portion of a lead and lower the height of products by arranging the lead for electronic parts having fork end-elastic members and external connection members as the external connection members are alternatively provided in front and rear faces of a circuit board of the electronic parts. CONSTITUTION:Two lead frames are provided in which a plurality of clip leads 11 are arranged in parallel respectively. The first lead frame is attached to a circuit board 1 by clamping the circuit board 1 with fork end-elastic members 11a of each clip lead 11. This results in external connection members 11b being arranged as sliding to one main face of the circuit board l. The external connection members 11b are attached to terminal patterns 1b to which the clip leads 11 are not attached as the direction of the external connection members 11b is changed. The fork end-elastic members 11a are soldered to the terminal patterns 1b, respectively. Then, each lead 11 is cut off from the lead frames to accomplish assembly of a zigzag inline-semiconductor device. Accordingly, pressure-forming is performed while the clip leads 11a are attached to the circuit board. Thus, folding portions for the clip leads are eliminated.