Vacuum suction device for thin parts, handling of sheet parts, sheet parts handling equipment, semiconductor wafer for transfers equipment

摘要

PURPOSE:To secure separation and suction in the titled device for semiconductor wafers, etc., by providing a plurality of holes of which one end can be connected with a negative pressure source distant from each other in a suction surface having a convex curved surface for forming a vacuum suction device. CONSTITUTION:A suction surface 11 of a vacuum suction device 10 is formed to be a convex curved surface forming part of a cylindrical surface, and two holes 14a, 14b are provided in it with a distance from each other. One end of the holes 14a, 14b is connected with a nozzle 14 which is connected with a negative pressure source. This nozzle 15 is connected with a vacuum pump through a solenoid valve and a switching valve. In this constitution, the suction surface 11 of the vacuum suction device 10 is contacted with a work 1 to suck it. The work 1 is deformed to be concave slightly by contact pressure of the convex surface, and the first work is deformed along the curved surface by suction by the holes 14a, 14b to be separated from the second work. In this constitution, it is separated and sucked securely.