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Automatic wiring processing unit of a multi-layer printed wiring board design automation equipment

机译:多层印刷线路板设计自动化设备的自动布线处理单元

摘要

PURPOSE:To effectively use all layers of a multilayer printed wiring board by performing automatic wiring processing after replacing with positional information of land pads which connect tip parts of outgoing wirings. CONSTITUTION:When two layers selected by a two-layer selection means 2 do not include land pads 11 and 12 to perform wiring processing, an outgoing wiring processing means 4 performs pattern pulling 13 from one side land pad 11 so as to form interlayer via holes 14 and 16 on the selected two layers respectively. In case the outgoing wiring processing succeeds, pattern pulling is performed from the via holes 14 and 16 by an interpoint automatic wiring processing means 5 respectively in order to perform wiring connection between the patterns 17 and 18 through an interlayer via hole 19. An interference judging means 7 checks whether or not this wiring connection interferes the other land pads or the like and in the case of no existing interference, wiring routes 13 to 19 are registered is a design data storage means 1. Thereby, all layers of a multilayer printed wiring board can be effectively used.
机译:目的:通过替换连接出线末端的焊盘的位置信息后执行自动布线处理,有效地使用多层印刷线路板的所有层。组成:当由两层选择装置2选择的两层不包括焊盘11和12进行布线处理时,输出布线处理装置4从一侧焊盘11进行图案拉拔13,以形成层间过孔分别在选定的两层上显示14和16。在输出布线处理成功的情况下,分别通过点间自动布线处理装置5从过孔14和16执行图案拉拔,以便通过层间过孔19在图案17和18之间进行布线连接。装置7检查该布线连接是否干扰其他焊盘等,并且在不存在干扰的情况下,将布线路径13至19登记在设计数据存储装置1中。由此,多层印刷布线的所有层板可以有效地使用。

著录项

  • 公开/公告号JP2593202B2

    专利类型

  • 公开/公告日1997-03-26

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP19880227454

  • 发明设计人 川道 武継;岡 常雄;

    申请日1988-09-13

  • 分类号H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-22 03:29:31

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