FORMATION OF PLASMA, METHOD FOR VAPOR-DEPOSITING METALLIC OXIDE AND ALUMINUM OXIDE VAPOR-DEPOSITED FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for stably forming plasma in a high vacuum of 1×10^-3 to 1×10^-5 Torr in which metal vapor deposition is executed and to provide a method for forming metallic oxide vapor-deposited coating film excellent in barrier performance by using this plasma. ;SOLUTION: This plasma forming method is the one in which a gas is introduced for forming plasma on the space between a cooled electrode Al having a magnet in the inside and an electrode B2 surrounding the electrode Al, and furthermore, ac voltage is applied to the space between the electrode A and the electrode B2 to form plasma by the gas within the electrode B, and moreover, voltage is applied to the space between the electrode A or electrode B and a third electrode C3 provided on the outer side of the electrode B to form the plasma of the gas released from the opening part of the electrode3 B on the space between the electrode A or electrode B and the electrode C. By specifying the reaction and reaction space between the flown metallic vapor and the plasma of the oxidizing gas, a transparent metallic oxide vapor-deposited film having high barrier performance can be obtd.;COPYRIGHT: (C)1998,JPO