首页> 外国专利> METODE PENGIKATAN BAGIAN-BAGIAN TIMAH HITAM DAN KOTAK PELINDUNG KE PAPAN RANGKAIAN YANG DICETAK, DAN METODE PENGIKATAN BAGIAN-BAGIAN KEPING, BAGIAN-BAGIAN TIMAH HITAM DAN KOTAK PELINDUNG KE PAPAN RANGKAIAN YANG DICETAK

METODE PENGIKATAN BAGIAN-BAGIAN TIMAH HITAM DAN KOTAK PELINDUNG KE PAPAN RANGKAIAN YANG DICETAK, DAN METODE PENGIKATAN BAGIAN-BAGIAN KEPING, BAGIAN-BAGIAN TIMAH HITAM DAN KOTAK PELINDUNG KE PAPAN RANGKAIAN YANG DICETAK

机译:黑锡零件和保护盒到印刷电路板的结合方法,以及板零件,黑锡零件和保护盒到印刷电路板的结合方法

摘要

A method of attaching a lead part and a shield case for preventing a high-frequency signal from being leaked to a printed circuit board includes a solder coating step of coating solder so that the solder should cover the whole of an aperture provided through a printed circuit board into which a lead of the lead part is inserted and so that the solder should cover a part of an aperture provided through the printed circuit board into which an engagement portion of the shield case is inserted, a mounting step of inserting the lead of the lead part and the engagement portion of the shield case into the respective apertures to thereby mount the lead part and the shield case on the printed circuit board, and a soldering step of inserting the printed circuit board mounted with the lead part and the shield case into a reflowing furnace and melting the solder to thereby carry out soldering.
机译:为了防止高频信号泄漏到印刷电路板上而安装引线部分和屏蔽盒的方法包括涂覆焊料的焊料涂覆步骤,使得焊料应当覆盖通过印刷电路提供的整个孔的整个部分。插入引线部分的引线的电路板,使得焊料应覆盖通过印刷电路板设置的孔的一部分,屏蔽壳的接合部分插入该孔,插入引线的引线的安装步骤引线部分和屏蔽盒的接合部分插入相应的孔中,从而将引线部分和屏蔽盒安装在印刷电路板上,以及焊接步骤,将安装有引线部分和屏蔽盒的印刷电路板插入到其中在回流炉中熔化焊料以进行焊接。

著录项

  • 公开/公告号ID18045A

    专利类型

  • 公开/公告日1998-02-19

    原文格式PDF

  • 申请/专利权人 SONY CORPORATION;

    申请/专利号ID19970002884

  • 发明设计人 ARATA TSURUSAKI;

    申请日1997-08-18

  • 分类号H02H7/00;H02H7/26;

  • 国家 ID

  • 入库时间 2022-08-22 02:56:09

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