A device for the removal of components of an article or to be able to eliminate unevennesses of the article, by means of a drawing device.

摘要

During the removal of components (2) from the support pad (1) the mechanism (3) is positively coupled to the compound by an adhesive (4), which also eliminates possible unevenness. Pref. the adhesive is of the hot melt type with operational temp. of 170 to 190 deg. C. The softening point of the adhesive may be between 81 to 85 deg. C. The removal typically starts 2 minutes after linking the mechanism to the component. The hot melt adhesive may be of low strength and retention. The mechanism has a hand portion, a coupler, and a foot portion.