Enhanced chemical-mechanical polishing (E-CMP) method of forming a planar surface on a thin film magnetic head to avoid pole recession

摘要

A method of enhanced chemical-mechanical polishing (E-CMP) utilizes an oxygen-rich liquid etchant in an abrasive slurry to form a substantially planar surface on a thin film magnetic head to substantially avoid pole recession. Illumination of the thin film magnetic head with ultraviolet light during E-CMP polishing greatly enhances the effect of the oxygen- rich etchant.