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PROXIMITY EFFECT CORRECTION MASK AND PROXIMITY EFFECT CORRECTION METHOD

机译:邻近效应校正面具和邻近效应校正方法

摘要

PROBLEM TO BE SOLVED: To improve the performance of semiconductor devices and the yield of production by providing a proximity effect correction mask and proximity effect correction method capable of additionally improving the dimensional accuracy of resist patterns. ;SOLUTION: Patterns 11 for a correction rule consisting of plural element patterns are superposed on mask patterns and are compared therewith. Correction parameter values are determined from the area values of the overlap with the mask patterns for each of the respective element patterns. The mask pattern edges are then corrected by using the sets of the correction parameter values and a conversion table. Since the correction is executed with the optimum correction rates to meet the shapes of the patterns, the dimensional accuracy of the patterns is improved.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:通过提供能够进一步提高抗蚀剂图案的尺寸精度的邻近效应校正掩模和邻近效应校正方法来提高半导体器件的性能和成品率。 ;解决方案:用于由多个元素图案组成的校正规则的图案11叠加在掩模图案上并与其进行比较。根据与各个元素图案中的每一个的与掩模图案重叠的面积值来确定校正参数值。然后通过使用校正参数值集和转换表来校正掩模图案边缘。由于以最佳校正率执行校正以适应图案的形状,因此提高了图案的尺寸精度。;版权所有:(C)1999,JPO

著录项

  • 公开/公告号JPH11143049A

    专利类型

  • 公开/公告日1999-05-28

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP19970307693

  • 发明设计人 TONAI KEIICHIRO;

    申请日1997-11-10

  • 分类号G03F1/08;H01L21/027;

  • 国家 JP

  • 入库时间 2022-08-22 02:34:57

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