Method of manufacturing a lead frame, mold resin sealed semiconductor device using a lead frame, a resin sealed semiconductor device and a resin sealed semiconductor device using the lead frame

摘要

PROBLEM TO BE SOLVED: To provide a lead frame capable of preventing deterioration of voltage withstanding property of a semiconductor device, when a common forming metal mold is used. SOLUTION: This lead frame is used for a resin sealed semiconductor device and has a plurality of lead parts 12a, 13a, 113b, 13c which are arranged corresponding to at least one outer peripheral surface of a resin sealed main body 16. A plurality of the lead parts contain at least one adjusting lead part 113b and are clamped by a forming metal mold which molds the resin sealed main body 16 at the time of resin sealing. The tip part of the adjusting lead part 113b is arranged at a position which is sufficiently near the outer peripheral surface, to such a degree that resin does not protrude from the adjusting lead part 113b at the time of resin sealing, and such a degree that the adjusting lead part 113b can be eliminated from the resin sealed main body 16 after resin sealing.