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Platinum alloy electroplate bath and platinum alloy electroplate manner

机译:铂合金电镀液和铂合金电镀方式

摘要

PURPOSE:To form a Pt-W alloy coating film having high corrosion resistance by carrying out alloy coating at a specified current density with a Pt alloy electroplating bath of a specified pH contg. a Pt compd. and tungstic acid. CONSTITUTION:A Pt-W alloy coating film is formed at 0.025-3.0A/dm2 current density with a Pt alloy electroplating bath of pH =3 contg. about 0.5-15g/l Pt compd. such as platinum chloride and about 0.5-30g/l (expressed in terms of W) tungstic acid and/or tungstate. At this time, the W content of the Pt-W alloy coating film is regulated to 3-40%. An amorphous alloy coating film having high corrosion resistance is obtd.
机译:目的:通过用规定pH值的Pt合金电镀液在规定的电流密度下进行合金涂层,以形成具有高耐腐蚀性的Pt-W合金涂膜。 Pt comp。和钨酸。组成:Pt-W合金涂膜以0.025-3.0A / dm 2的电流密度通过pH> = 3 contg的Pt合金电镀浴形成。约0.5-15g / l铂例如氯化铂和约0.5-30g / l(以W表示)的钨酸和/或钨酸盐。此时,Pt-W合金涂膜的W含量为3〜40%。具有高耐腐蚀性的非晶态合金涂膜。

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