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a multilayer printed circuit board (pcb) process for the production of coatings increased with längsgerichteten fibresquergerichteten layers reinforced with fibres and at least one metal middle class
a multilayer printed circuit board (pcb) process for the production of coatings increased with längsgerichteten fibresquergerichteten layers reinforced with fibres and at least one metal middle class
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机译:增加纤维和至少一种金属中产阶级的高密度纤维增强的多层涂层的多层印刷电路板(pcb)的生产工艺
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摘要
The invention relates to a method of manufacturing a composite laminate having a plurality of UD layers, i.e., layers of matrix material reinforced with unidirectionally oriented fibres, and at least one inner metal layer, i.e., a metal layer that does not form an outer surface of the laminate, the layers being arranged so as to give a balanced and symmetric laminate. The method comprises passing through a laminating zone, preferably a double-belt press, unidirectionally oriented (UD) fibres provided with not yet consolidated matrix material and consolidating the matrix material. In a first step a non-flowing sandwich laminate of at least three layers is formed, the at least three layers being UD and metal layers, the sandwich laminate being formed by passing UD fibres provided with not yet consolidated matrix material through the laminating zone together with metal foil, and in a second step the non-flowing sandwich laminate is provided on its outer surfaces with UD layers, with additional UD layers optionally being added in subsequent steps.
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