BA Semiconductor Package Inspection System

摘要

The present invention relates to an apparatus for supplying an inspection system for a BGA semiconductor package, and to supplying a tray in which a plurality of materials are placed to an inspection apparatus using manual labor to inspect a solder ball of a material in the manufacture of a BGA semiconductor package It was not easy to cause damage and handling of materials due to the flow of, and setting work was not easy when setting each material in vision, and there was a problem of deterioration of test workability and weakening of test reliability.;According to the present invention, a material transfer tray in which a plurality of materials are placed in a stack is stored in order to supply a material of a BGA semiconductor package in which a solder ball is fused through each process to an inspection system for inspecting solder balls and ball positions. The feeder has an input conveyor for conveying the magazine, a gripper for clamping and moving the magazine of the input Kenveyer, an elevator for positioning and fixing the magazine, and an up and down elevator, and a pusher for discharging the material transfer tray in the magazine to the outside. It is provided to facilitate the supply of materials, to facilitate the operation of solder ball inspection, and to increase the accuracy of the inspection.