首页> 外国专利> METHOD OF MAKING THROUGH HOLE WITH LASER COPPER-CLAD LAMINATE SUITABLE FOR MAKING HOLE AND AUXILIARY MATERIAL FOR MAKING HOLE

METHOD OF MAKING THROUGH HOLE WITH LASER COPPER-CLAD LAMINATE SUITABLE FOR MAKING HOLE AND AUXILIARY MATERIAL FOR MAKING HOLE

机译:用适合于制造孔的激光覆铜板叠层制造孔的方法和制造孔的辅助材料

摘要

The present invention relates to a method of manufacturing a small-diameter through hole having high reliability with respect to a hole wall at a high speed by the energy of a carbon dioxide gas laser without forming any hole in a copper foil in advance, At least one powder selected from the group consisting of a metal compound powder, a carbon powder and a metal powder having a melting point of at least 900C and a binding energy of at least 300 KJ / mol, To 97% by volume of the organic substance is formed or arranged on at least one copper foil surface to be irradiated with a carbon dioxide gas laser, Irradiating the surface with a pulsed carbon dioxide gas laser; The auxiliary material used when a through hole is made in a copper-clad laminate with a carbon dioxide gas laser is a metal compound powder, a metal powder having a melting point of at least 900C and a binding energy of at least 300 KJ / mol, Is a coating or sheet of an organic material containing 3 to 97% by volume of at least one powder selected from the group consisting of:
机译:本发明涉及一种在不预先在铜箔上形成孔的情况下,利用二氧化碳气体激光的能量以高速制造相对于孔壁具有高可靠性的小直径的通孔的方法。一种选自金属化合物粉末,碳粉末和金属粉末的粉末,其熔点为至少900℃且结合能为至少300KJ / mol,相对于97体积%的有机物质为:形成或布置在至少一个铜箔表面上,以用二氧化碳气体激光器照射;用脉冲二氧化碳气体激光器照射该表面;当用二氧化碳气体激光器在覆铜层压板中形成通孔时使用的辅助材料是金属化合物粉末,熔点至少为900C且结合能至少为300 KJ / mol的金属粉末。 ,是一种有机材料的涂层或片材,包含3至97体积%的至少一种粉末,该粉末选自:

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