Wafer adsorption table for foil mount process for semiconductor package manufacturing

摘要

The present invention improves the structure of the wafer adsorption table used in the foil mount process for semiconductor package manufacturing so that it can be used for general purposes, thereby reducing the inconvenience and cost for replacing the wafers every time. It is to reduce.;To this end, the present invention is a wafer adsorption table for adsorbing a wafer under vacuum pressure; A center zone 3 having an air blow hole 2 is formed in the center of the wafer adsorption table 1, and a circular recessed surface 4 around the air blow hole 2 along a radial direction; There is provided a wafer adsorption table in a foil mounting process for manufacturing a semiconductor package in which circular seating portions 6 having a vacuum hole 5 are alternately formed.