NICKEL-PLATED ALUMINUM BASE COMPOSITE MATERIAL EXCELLENT IN SOLDERABILITY AND PRODUCTION OF THE NICKEL- PLATED ALUMINUM BASE COMPOSITE MATERIAL

摘要

PROBLEM TO BE SOLVED: To satisfactorily execute soldering even under the condition of non-flux by plating an aluminum base composite material with an Ni layer, thereafter executing heating and reducing away an oxidized film in the Ni plating layer.;SOLUTION: An aluminum base composite material is plated with an Ni layer and is thereafter heated at about 200 to 500°C in a reducing atmosphere to reduce away an oxidized film in the Ni plating layer. Alternatively, the oxidized film in the Ni plating layer is removed by using an acidic soln. Further alternatively, the oxidized film in the Ni plating layer is removed by grinding. The peak value of the concn. of oxygen in the Ni plating layer formed on the surface of the aluminum base composite material is controlled to ≤10 at.%. In order to measure the oxygen concn. in the Ni plating layer, Auger electron spectroscopy suitable for the quantitative analysis of the surface compsn. is adopted. It is preferable that soldering is executed directly after the removal of the oxidized film in the Ni plating layer. In the case there is a long time before soldering, preferably, it is stored in a nonoxidizing atmosphere.;COPYRIGHT: (C)2000,JPO