首页> 外国专利> Covered electrical connection used for testing semiconductor wafers contains a connecting track electrically joined to one end of a connecting structure made of conducting material on a substrate

Covered electrical connection used for testing semiconductor wafers contains a connecting track electrically joined to one end of a connecting structure made of conducting material on a substrate

机译:用于测试半导体晶圆的有盖电连接包含一个连接轨,该连接轨电连接到基板上由导电材料制成的连接结构的一端

摘要

Covered electrical connection contains a connecting track electrically joined to one end of a connecting structure made of conducting material on a substrate, a contact on the outer edge of the track to electrically join with a connecting spot, a connecting wire joining an upper surface of the spot with the contact, and an elastomer element arranged below the substrate. Covered electrical connection contains a holder for holding the connecting structure, and an elastomer element arranged below the substrate and giving the electrical connection its flexibility. Independent claims are also included for similar covered electrical connections.
机译:覆盖的电连接包含一个连接轨道,该轨道电连接到由导电材料制成的基板上的连接结构的一端,该轨道的外边缘上的触点与连接点电连接,连接线连接该连接结构的上表面点与触点接触,并且弹性体元件布置在基板下方。覆盖的电连接包括用于保持连接结构的保持器,以及布置在基板下方并赋予电连接其柔性的弹性体元件。对于类似的覆盖电连接也包括独立权利要求。

著录项

  • 公开/公告号DE10003073A1

    专利类型

  • 公开/公告日2000-08-03

    原文格式PDF

  • 申请/专利权人 ADVANTEST CORP. TOKIO/TOKYO;

    申请/专利号DE2000103073

  • 发明设计人 JONES MARK R.;KHOURY THOEDORE A.;

    申请日2000-01-25

  • 分类号H01R11/18;G01R31/28;H01R43/00;B81B3/00;H01L21/66;

  • 国家 DE

  • 入库时间 2022-08-22 01:41:59

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