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Surface acoustic wave device production method, involves connecting surface acoustic wave device with base construction over bump in order to connect device with base
Surface acoustic wave device production method, involves connecting surface acoustic wave device with base construction over bump in order to connect device with base
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机译:声表面波器件的生产方法,涉及将声表面波器件与基座结构连接在凸块上,以便将器件与基座连接
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摘要
The method involves connecting an surface acoustic wave device with a base construction over a bump in order to connect the device with the base. A lid is connected with base in a way that the lid coats the device. The device is heated at a high temperature.
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