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Embedding medium, in particular for cathodes, a process for the production of such an embedding compound and use of such an embedding compound

机译:包埋介质,特别是用于阴极的包埋介质,该包埋化合物的生产方法以及该包埋化合物的用途

摘要

Novel embedding material, with low heat capacity and high thermal conductivity, comprises sintered mixt. of a first component of W and/or the metal powder and a second component of Ru, Rh, Fd, Re, Os, ir and/or Pt metal powder. Procersses for prodn. of the embedding material are also claimed. USE/ADVANTAGE - Used for embedding heating elements or temp. sensors, pref. the cathode heating elements of electron tubes, esp. electron beam and microwave tubes e.g. travelling field tubes, klystrons, magnetrons etc. It has good compatibility with other materials, has good prodn. and working properties and has a relatively low sintering temp. of 800-2000 (1000-1500, esp. 1200) deg.C.
机译:具有低热容量和高导热率的新型包埋材料包括烧结混合物。 W和/或金属粉末的第一成分和Ru,Rh,Fd,Re,Os,ir和/或Pt金属粉末的第二成分。产品的程序。还要求保护嵌入材料的数量。使用/优点-用于嵌入加热元件或温度。传感器,首选电子管的阴极加热元件,特别是电子束和微波管行进场管,速调管,磁控管等。与其他材料的相溶性好,产品良好。和工作特性,并且具有较低的烧结温度。 800-2000(1000-1500,特别是1200)摄氏度

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