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Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads
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机译:使用环氧模塑料垫的半导体封装结构以及制造环氧模塑料垫的方法
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摘要
A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are cut from an EMC pad pattern which is formed from a predetermined number of EMC tablets. The EMC pad pattern is molded by heating and pressing the EMC tablets into a wafer shape having a thickness of approximately 0.3 mm and a diameter of approximately 100 mm. Such a thin EMC pad is capable of providing sufficient dielectric strength, and allows for manufacturing of semiconductor packages at lower cost. In addition, conventional equipment can be used to fabricate the semiconductor packages. The packages are flexible, and even a thin package is not easily broken.
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