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Plasma processing monitor with a multivariate statistical analysis of plasma emission spectra

机译:等离子处理监视器,具有等离子发射光谱的多元统计分析

摘要

(57) I will provide a summary] [plasma processing analysis technology. I will monitor the progress of treatment, each intensity of the radiation wavelength of P number emitted from the plasma treatment. With the progress of processing, the display of the P-dimensional correlation between the intensities of the P number of wavelengths to be monitored are generated. Compared to the correlation between the predetermined display generated on the basis of the plasma processing state of the past, the correlation display thus generated, to detect the state conditions of processing (status conditions). According to this technique, a specific template, which can be predicted a priori for evaluating the radiation emitting data during plasma processing is not necessary. Study a variety of complex correlation, which is formed in a variety of radiation between wavelengths during plasma processing, there is to discover, this analysis technique does not compel the prediction for the trend or relationship specific of various wavelengths between. Thus, to monitor the plasma processing using a correlation to be present in the radiation between wavelengths is found. This analysis technique allows the evaluation of the interaction that occurs have woven the full spectrum of the radiation emission wavelength that has been detected. Therefore, changes similar occurring in a predetermined processing by the processing proceeds through the stages, changes caused by variations in the physical process environment and also electrically detected, this analytical technique can be analyzed.
机译:(57)我将提供[等离子体处理分析技术摘要]。我将监视治疗进度,每个强度的辐射波长从等离子体处理发出的P数。随着处理的进行,生成要监视的P个波长的多个强度之间的P维相关的显示。与基于过去的等离子体处理状态而生成的预定显示之间的相关性相比,如此生成的相关性显示用于检测处理的状态条件(状态条件)。根据该技术,不需要特定模板,该特定模板可以被先验地预测以用于在等离子体处理期间评估辐射发射数据。研究各种复杂的相关性,即在等离子体处理过程中在各种波长之间的各种辐射中形成的,有待发现,这种分析技术并不强迫对各种波长之间的趋势或特定关系的预测。因此,发现使用在波长之间的辐射中存在的相关性来监视等离子体处理。这种分析技术可以评估已经编织的已检测辐射发射波长的完整光谱所发生的相互作用。因此,通过该处理在预定处理中发生的类似变化经过各个阶段,由于物理处理环境的变化而引起的变化并且还被电检测,因此可以分析该分析技术。

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