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Plasma processing monitor with a multivariate statistical analysis of plasma emission spectra
Plasma processing monitor with a multivariate statistical analysis of plasma emission spectra
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机译:等离子处理监视器,具有等离子发射光谱的多元统计分析
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摘要
(57) I will provide a summary] [plasma processing analysis technology. I will monitor the progress of treatment, each intensity of the radiation wavelength of P number emitted from the plasma treatment. With the progress of processing, the display of the P-dimensional correlation between the intensities of the P number of wavelengths to be monitored are generated. Compared to the correlation between the predetermined display generated on the basis of the plasma processing state of the past, the correlation display thus generated, to detect the state conditions of processing (status conditions). According to this technique, a specific template, which can be predicted a priori for evaluating the radiation emitting data during plasma processing is not necessary. Study a variety of complex correlation, which is formed in a variety of radiation between wavelengths during plasma processing, there is to discover, this analysis technique does not compel the prediction for the trend or relationship specific of various wavelengths between. Thus, to monitor the plasma processing using a correlation to be present in the radiation between wavelengths is found. This analysis technique allows the evaluation of the interaction that occurs have woven the full spectrum of the radiation emission wavelength that has been detected. Therefore, changes similar occurring in a predetermined processing by the processing proceeds through the stages, changes caused by variations in the physical process environment and also electrically detected, this analytical technique can be analyzed.
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