Production manner null of Japanese white-eye layout wiring

摘要

PURPOSE: To enable a large wiring board to be divided into unit wiring boards twice or more as many as those obtained in a conventional method and to automate a chip mounting process by a method wherein grooving work is carried out to the large wiring board with a molding die provided with cutting edges correspondent to V-shaped grooves each located between unit wiring patterns. ;CONSTITUTION: A side-by-side arrangement wiring board 1 is composed of an insulating board 2, unit wiring patterns 3 on the board 2, a a cavity 4 where a quartz oscillator is mounted, and a metal frame 5 bonded to the periphery of a unit board. A pitch between the wiring patterns 3 is measured, a large number of cutting edges 7a and 8a are provided to an upper and a lower die, 7 and 8, respectively corresponding to the measured pitch, and the dies 7 and 8 are arranged above and below the wiring board 1 respectively and pressed together against, the board 1, whereby grooves are provided to the board 1. A lug can be dispensed with, so that a large wiring board to be divided into unit wiring boards twice or more as many as those obtained in a conventional method. A large number of grooves can be provided at a time, so that work man-hours can be reduced to 1/100 or less. Burrs are prevented from being generated at the peripheral edge of a unit wiring board, and a chip mounting process can be easily automated.;COPYRIGHT: (C)1994,JPO&Japio