device for the application of paint on a board shaped osulla surface of a board to a piece to be processed.

• 1. 用于加工具有透明层、玻璃层、玻璃状层、陶瓷层和/或结晶层的板状工件的方法，用于这类工件的分割装置以及由这类工件制成的产品 [P] . 中国专利： CN105592994A . 2016-05-18
• 2. 板状工件的夹持装置和板状工件的夹持方法 [P] . 中国专利： CN113799097A . 2021-12-17
• 3. device for the application of paint on a board shaped or on the surface of a board to a piece to be processed. [P] . ITGE960011U1 . 1997-10-06

  机译： 用于在板状或板表面上将油漆施加到要处理的工件上的设备。

• 4. device for the application of paint on a board shaped or on the surface of a board to a piece to be processed. [P] . ITGE960011V0 . 1996-04-05

  机译： 用于在板状或板表面上将油漆施加到要处理的工件上的设备。

• 5. Device for selbsttaetigen division of the board-shaped workpieces to a long piece or a board web differential aeft of various to one another, relatively short board-shaped workpieces (am of the workpiece, and business - and distribution system with such a device [P] . 德国专利： DE1628881A1 . 1971-08-12

  机译： 用于将板状工件自分离成长块或彼此不同的板幅差速器的装置，具有相对短的板状工件（工件和工种）以及具有这种装置的分配系统

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• 2. Surface Breakdown of Printed Circuit Board under Magnetic Field with Reduced Pressure [J] . DU Boxue, ZHU Xiaohui, GAO Yu, 天津大学学报（英文版） . 2010,第001期
• 3. Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems [C] . E. Bosman, B. Van Hoe, J. Missinne, Optical Interconnects XIV . 2014
• 4. Design and Applications of Printed-Circuit-Board Huygens' Metasurfaces [D] . Chen, Michael. 2021
• 5. From the American Board of Family Medicine: AMERICAN BOARD OF FAMILY MEDICINE LAUNCHES NEW EXAM PREP IPHONE APPLICATION [O] . Michele Mason 2011
• 6. Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer. [O] . Motoyo WAJIMA 1994

• 1. Efficiency of Coir Particle Board for Acoustic amp;Thermal Applications [J] . M. C. Kiran ,B. S. Mamatha ,N. Anand . 声学期刊（英文） . 2019,第3期
• 2. Evaluation of Inherent Uncertainties of the Homogeneous Effective Thermal Conductivity Approach in Modeling of Printed Circuit Boards for Space Applications [J] . Rafael Lopes Costa ,Valeri Vlassov . 电子器件冷却与温度控制期刊（英文） . 2013,第1期
• 3. Surface Characterization of Metallic Particles in Printed Circuit Board Comminution Fines and the Processing Implication [J] . Iyiola Olatunji Ogunniyi ,M. K. G. Vermaak ,Dick Groot . 矿物质和材料特性和工程（英文） . 2012,第6期
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• 5. 应用于室内分布系统的定向板状天线及合路器的研究 [A] . 高驰 . 2015