METHOD OF MANUFACTURING A HYBRID INTEGRATED CIRCUIT COMPONENT HAVING A LAMINATED BODY AND HYBRID INTEGRATED CIRCUIT COMPONENT

摘要

Hybrid (hybrid) integrated circuit devices include substrates, thin film integrated circuits formed on the substrate through thin film processes, and lamination type passive circuit devices such as capacitors, inductors, resistors, and combinations thereof formed on the integrated circuits. Include. During ignition of passive circuit elements in a hydrogen atmosphere, the semiconductor layers that make up the integrated circuit are annealed. Various substrates may be used as the substrate, for example, an inexpensive semiconductor substrate that is not subjected to mirror-grinding using quartz, ceramic, or glass layers.