Test Structure and Method for Measuring Minimum Area Design Rule

摘要

In order to determine whether the designed minimum area design rule can be applied to the semiconductor device manufacturing process, it is possible to perform the test in a short time by the electrical test rather than the visual measurement by the inspector, and at the same time, the accurate design rule for the minimum area. In order to measure electrical conductivity, a conductive film of any size desired to be measured between the upper and lower conductive layers for electrical conduction is inserted into a sandwich structure by contacts and vias, and then connected in a chain form to measure probabilistic data. By forming a test structure and applying a bias to the test structure to electrically measure the minimum region design rule, the design region can accurately select the minimum region of the pattern that can be applied to the actual semiconductor device manufacturing process. Chip of semiconductor device by minimizing pattern size It is advantageous for miniaturization of semiconductor devices by reducing the size, and electrically tests the minimum area design rule, which enables faster measurement time and probabilistic accurate data compared to the measurement by intuition or visual inspection of conventional inspectors. In addition to this, design rules in an electrical sense can be obtained.