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Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
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机译:使用共面波导和BGA I / O格式的微波电路封装的低成本宽带RF端口结构
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摘要
A MMIC package comprises a trace pattern of a coplanar wave guide which matches impedances at all transitions to enhance signal transmission and avoid reflection. The invention employs metalization on a dielectric substrate material wherein this metalization is patterned in order to provide gaps and signal carrying conductors which enhance the signal propagation and reduce impedance mismatches in order to provide a package capable of handling high frequency microwave signals.
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