Method for improving the reliability of underfill process for a chip

摘要

A hole is generated in a substrate. A chip is connected to the substrate by using the chip receiving area of the substrate by using flip chip assembly. The hole is aligned to the chip receiving area of the substrate. Then, a underfill process is performed such that the space between the chip and the substrate will be encapsulated using liquid capsulated material. The liquid capsulated material is injected into the hole from the back side surface of the substrate to the front side surface of the substrate.