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SiGe FILM FORMING METHOD, METHOD OF MANUFACTURING HETEROJUNCTION TRANSISTOR AND HETEROJUNCTION BIPOLAR TRANSISTOR

机译:SiGe膜的形成方法,异质结晶体管的制造方法及异质结双极性晶体管

摘要

PROBLEM TO BE SOLVED: To prevent an SiGe film on an insulating film from becoming rough and to improve film quality and film resistance in an SiGe film forming method, a manufacturing method of a heterojunction transistor and a heterojunction bipolar transistor.;SOLUTION: A method for forming a SiGe film 8 on the insulating film 6 is provided with a buffer forming process for forming a first Si(1-x)Gex film 9 (0≤x0.05) on the insulating film and a main film forming process for forming a second Si(1-y)Gey film 10 (0.05≤y1) on the first Si(1-x)Gex film. The buffer forming process forms the first Si(1-x)Gex in the thickness range of 0.5 nm to 5 nm.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:为了防止绝缘膜上的SiGe膜变粗糙并提高SiGe膜形成方法中的膜质量和膜电阻,该方法是异质结晶体管和异质结双极晶体管的制造方法。用于在绝缘膜6上形成SiGe膜8的步骤包括用于在绝缘膜上形成第一Si(1-x)Gex膜9(0le; x <0.05)的缓冲形成过程以及用于形成的主膜形成过程。在第一Si(1-x)Gex膜上的第二Si(1-y)Gey膜10(0.05 <y <1)。缓冲层形成工艺形成厚度在0.5 nm至5 nm范围内的第一个Si(1-x)Gex .;版权所有:(C)2001,JPO

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