首页> 外国专利> PART RELIABILITY INFORMATION COLLECTING METHOD, PART RELIABILITY INFORMATION STORAGE DEVICE, PART RELIABILITY INFORMATION PROVIDING DEVICE, AND PART RELIABILITY INFORMATION PROVIDING METHOD

PART RELIABILITY INFORMATION COLLECTING METHOD, PART RELIABILITY INFORMATION STORAGE DEVICE, PART RELIABILITY INFORMATION PROVIDING DEVICE, AND PART RELIABILITY INFORMATION PROVIDING METHOD

机译:部件可靠性信息收集方法,部件可靠性信息存储设备,部件可靠性信息提供设备和部件可靠性信息提供方法

摘要

PROBLEM TO BE SOLVED: To easily estimate the reliability of semiconductor parts in a mounted state without requiring much labor and time and to easily judge the employment feasibility of the semiconductor parts.;SOLUTION: An apparatus manufacturing maker 14 presents the individual information and manufacturing information of the semiconductor parts to be used to the management server 13b of a service dealer 12. The management server 13b receiving the presented information analyzes and estimates the reliability when the semiconductor parts a printed circuit board, and connecting materials are combined to form a circuit board in reference to the individual information and the reliability evaluation result information of the semiconductor parts and returns the estimated result to the apparatus manufacturing maker 14 to obtain compensation. The apparatus manufacturing maker 14 judges the employment feasibility of the semiconductor parts according to the estimated result.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:在不需要大量劳力和时间的情况下容易地估计处于安装状态的半导体部件的可靠性,并容易地判断半导体部件的使用可行性。解决方案:装置制造商14提供各个信息和制造信息服务代理商12的管理服务器13b中使用的半导体部件的数量。接收到的信息的管理服务器13b分析并估计当将半导体部件,印刷电路板和连接材料组合在一起以形成电路板时的可靠性参考半导体部件的个体信息和可靠性评估结果信息,并将估计结果返回设备制造商14以获得补偿。装置制造商14根据估计结果判断半导体部件的使用可行性。版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001356148A

    专利类型

  • 公开/公告日2001-12-26

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP20000178675

  • 发明设计人 FUKUDA YOSHIKI;

    申请日2000-06-14

  • 分类号G01R31/30;G06F17/40;G06F17/60;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:02

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