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PART RELIABILITY INFORMATION COLLECTING METHOD, PART RELIABILITY INFORMATION STORAGE DEVICE, PART RELIABILITY INFORMATION PROVIDING DEVICE, AND PART RELIABILITY INFORMATION PROVIDING METHOD
PART RELIABILITY INFORMATION COLLECTING METHOD, PART RELIABILITY INFORMATION STORAGE DEVICE, PART RELIABILITY INFORMATION PROVIDING DEVICE, AND PART RELIABILITY INFORMATION PROVIDING METHOD
PROBLEM TO BE SOLVED: To easily estimate the reliability of semiconductor parts in a mounted state without requiring much labor and time and to easily judge the employment feasibility of the semiconductor parts.;SOLUTION: An apparatus manufacturing maker 14 presents the individual information and manufacturing information of the semiconductor parts to be used to the management server 13b of a service dealer 12. The management server 13b receiving the presented information analyzes and estimates the reliability when the semiconductor parts a printed circuit board, and connecting materials are combined to form a circuit board in reference to the individual information and the reliability evaluation result information of the semiconductor parts and returns the estimated result to the apparatus manufacturing maker 14 to obtain compensation. The apparatus manufacturing maker 14 judges the employment feasibility of the semiconductor parts according to the estimated result.;COPYRIGHT: (C)2001,JPO
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