An enhanced memory module assembly comprises a memory module including a substrate with a plurality of conductive traces arranged in an edge thereof. A connector includes a first housing having a memory module receiving slot extending along a longitudinal direction thereof. The housing further defines a plurality of terminal cells with a plurality of first terminals assembled therein. Each terminal includes a first end extending into the elongate slot for electrically contacting with the conductive traces. A ZIF device is arranged between the memory module and includes a pair of actuator receiving slots located in the housing and in communicating with the terminal cells, and an actuator attached to the memory module. The actuator includes a pair of actuating plates extending into the actuator receiving slots thereby pushing the terminals in electrical contact with the conductive traces when the memory module is completely inserted therein.
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