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Method for fabricating semiconductor laser device by aligning semiconductor laser chips based on light emission measurements
Method for fabricating semiconductor laser device by aligning semiconductor laser chips based on light emission measurements
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机译:通过基于发光测量值对准半导体激光器芯片来制造半导体激光器的方法
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摘要
After profiles of two chips are recognized on intermediate stages and their positions are corrected, collets are used as electrodes and a voltage is applied to the chips on bonding stage on which the chips are bonded onto a submount. Then, the respective two chips are allowed to emit light, final position correction is performed on the basis of the light-emission point data and bonding is performed. The two chips can be bonded at narrow pitches by tilting the collets with respect to chip surfaces. Consequently, two laser chips can be bonded at narrow pitches on one submount in high position accuracy.
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