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Planar inverted F antenna with high impedance ground-plane structure for use in Bluetooth (RTM) communication module uses high impedance ground-plane to increase bandwidth of antenna
Planar inverted F antenna with high impedance ground-plane structure for use in Bluetooth (RTM) communication module uses high impedance ground-plane to increase bandwidth of antenna
A high impedance ground-plane (25) is connected to the plate constituting the counterpoise (10) and is provided with a feeding pin (15) that is connected via a hole in the counterpoise to the output terminal of the power amplifier supplying a radiator element (20) with radio frequency power to be radiated. AN Independent claim is included for a method of producing a microwave antenna device.
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