PURPOSE: Provided is an epoxy resin composition for sealing a semiconductor device, which has excellent flame retardancy, long-term stability at high temperature, and moisture-proofing, electrical reliability by using environment friendly fire-retardant. CONSTITUTION: The epoxy resin composition comprises epoxy resin, hardener, hardening stimulator, inorganic filler, fire retardant, colorant, and other additives. The flame retardant is prepared by primarily coating a phosphorus or phosphorus compound(1) with metal oxide, hydroxide or resin thereof(2,3); secondarily coating the coated phosphorus or phosphorus compound with 40-90 parts by weight of setting resin composition(4) based on 100 parts by weight of the phosphorus or phosphorus compound; and hardening the dually coated phosphorus or phosphorus compound to form a three-dimensional network structure.
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