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Thin film formation method by laser ablation or high voltage discharge plasma CVD or laser ablation combined with high voltage discharge plasma CVD
Thin film formation method by laser ablation or high voltage discharge plasma CVD or laser ablation combined with high voltage discharge plasma CVD
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机译:激光烧蚀或高压放电等离子体CVD或激光烧蚀结合高压放电等离子体CVD的薄膜形成方法
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摘要
In the thin film forming method such as the laser ablation method, the plasma CVD method, or the combination method of the two methods according to the present invention, the laser beam 2 generated from the excimer or yag laser 1, which is a laser source, is used. Particles (laser plume 7) protruding from the surface when the fixed target 6 located in the vacuum chamber 5 are irradiated by condensing with the lens 3 and using an optical device called a driving reflector 4. A laser ablation method for forming a thin film on the substrate 9 located on the substrate heater 8, a plasma zone generated by applying a high voltage between the cathode 10 and the anode 11 made of a material to be sputtered ( Plasma CVD method for forming a thin film on the substrate 9 installed on the anode 11 located in the center of 12), the two methods are specially combined so that the above two deposition processes are performed at the same time. group (9) A method of forming a thin film such as a thin film device, wherein the plasma density is increased during the deposition process of the above three methods to increase the excitation efficiency and the deposition rate to form a thin film such as a thin film of good quality. In addition, the method may further include applying an electromagnetic field generated from the electromagnet 14 to the laser plume zone or plasma zone surrounded by the special high temperature heat-treated glass reactor 13.
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