Methods of plating on insulating substrates and plating grants obtained by the methods

摘要

It is an object of the present invention to provide a method capable of easily producing a thin layer of a metal having good adhesion to a substrate on an insulating substrate having a smooth surface at low cost, and a plating imparting material obtained by the method.;The present invention provides a method of plating on an insulating substrate, comprising: forming a conductive film containing an oxide on an insulating substrate, and performing a reduction treatment on the conductive film surface layer to form a reducing layer on the conductive film surface layer. And a step 3 of forming a catalyst layer on the surface of the reduced layer by applying a treatment solution containing ions of a metal having a catalytic action to the reducing layer, and plating metal on the conductive film having the catalyst layer. Characterized in that it holds.