首页> 外国专利> Silicon carbide FET for high frequency and high performance use comprises a source electrode, a drain electrode and a gate electrode in a layer sequence of different poly-type silicon carbides on a substrate made from silicon carbide

Silicon carbide FET for high frequency and high performance use comprises a source electrode, a drain electrode and a gate electrode in a layer sequence of different poly-type silicon carbides on a substrate made from silicon carbide

机译:用于高频和高性能的碳化硅FET在由碳化硅制成的基板上以不同的多型碳化硅的层顺序包括源电极,漏电极和栅电极

摘要

Silicon carbide FET comprises a source electrode (5), a drain electrode (6) and a gate electrode (7) in a layer sequence of different poly-type silicon carbides on a substrate (2) made from silicon carbide. The substrate and a covering layer (4) arranged below the electrodes are made from hexagonal poly-type silicon carbide. A functional layer (3) made from cubic silicon carbide is arranged between the substrate and the covering layer. The layers are applied to one side of the substrate. An independent claim is also included for a process for the production of the silicon carbide FET. Preferred Features: The substrate is made from 6H silicon carbide, 4H silicon carbide or semi-insulating hexagonal silicon carbide. The covering layer is n-doped. The functional layer is n-doped up to a zone in the nanometer range as boundary layer to the covering layer.
机译:碳化硅FET在由碳化硅制成的基板(2)上以不同的多型碳化硅的层顺序包括源电极(5),漏电极(6)和栅电极(7)。基板和布置在电极下方的覆盖层(4)由六角形多型碳化硅制成。由立方碳化硅制成的功能层(3)布置在基板和覆盖层之间。将这些层施加到基底的一侧。还包括用于制造碳化硅FET的方法的独立权利要求。优选特征:基底由6H碳化硅,4H碳化硅或半绝缘六角形碳化硅制成。覆盖层是n掺杂的。功能层被n掺杂直至纳米范围的区域作为覆盖层的边界层。

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