TOOL FOR ANALYZING IMPURITY IN SEMICONDUCTOR WAFER, AND IMPURITY ANALYSIS METHOD OF SEMICONDUCTOR WAFER USING THE TOOL

摘要

PPROBLEM TO BE SOLVED: To provide a technique for accurately evaluating impurities regarding one portion on the surface of a semiconductor wafer. PSOLUTION: The impurity analysis tool 1 is used for analyzing impurities adhering to a semiconductor wafer and comprises a body 2 where the semiconductor wafer is accommodated, and a lid section 3 that is integrated with the body. The lid section has an opening 5. When the body is integrated with the lid section, a semiconductor wafer W that is accommodated in the body is retained in contact with the lid section, and at the same time only a section 8 that is exposed through the opening can be etched. The semiconductor wafer is retained in contact by the tool, only a portion that is exposed through the opening of the lid section is etched by a chemical liquid, and a recovered chemical liquid is analyzed by using an analyzing apparatus. PCOPYRIGHT: (C)2003,JPO