SELECTIVE ANODE BONDING METHOD AND FULL-FACE ANODE BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To make it possible to minimize areas of concave membrane, in a selective anode bonding method in which glass substrates and electroconductive substrates or semiconductor substrates having zones which must be bonded and zones which must not be bonded are bonded. ;SOLUTION: The selective anode bonding method in which the zones which must be bonded between the both substrates are selectively bonded, by controlling the degree of effect of applied voltage when bonded. In particular, upon forming concave portions on the back side of the banding portion of the glass substrate to reduce the thickness of the glasses, the same voltage is applied to the electrodes formed on the whole opposite surfaces and the electroconductive substrate or the semiconductor substrate at a predetermined temperature. Or, the electrode is formed only on the back side of the zone which must not be bonded, and the voltage is applied between the glass substrate and the electroconductive substrate or the semiconductor substrate, while maintaining the electrode and the electroconducitive substrate or semiconductor substrate at the same electric potential at a predetermined temperature. Additionally, the methods in which the concave portions are formed can be applied to full-face anode bonding methods in which the glass substrate and the electroconductive substrate or the semiconductor substrate are bonded over the full surface thereof.;COPYRIGHT: (C)2003,JPO