首页> 外国专利> Light for use in activating light-activated materials, the light having at least one light emitting semiconductor chip, the chip being attached to a primary heat sink that is attached to a secondary heat sink using heat conductive and electrically insulative adhesive

Light for use in activating light-activated materials, the light having at least one light emitting semiconductor chip, the chip being attached to a primary heat sink that is attached to a secondary heat sink using heat conductive and electrically insulative adhesive

机译:用于激活光激活材料的光,该光具有至少一个发光半导体芯片,该芯片连接到主散热器,该主散热器使用导热和电绝缘性粘合剂连接到副散热器

摘要

Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
机译:公开了用于激活光激活材料的光系统。公开了发光半导体芯片和散热器的各种配置,以及驱动,控制和使用它们的各种结构和方法,以及可与其一起使用的材料和结构。

著录项

  • 公开/公告号US2002190660A1

    专利类型

  • 公开/公告日2002-12-19

    原文格式PDF

  • 申请/专利权人 CAO GROUP INC.;

    申请/专利号US20020189323

  • 发明设计人 DENSEN CAO;

    申请日2002-07-03

  • 分类号H05B37/02;

  • 国家 US

  • 入库时间 2022-08-22 00:10:49

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