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Current crowding reduction technique for flip chip package technology
Current crowding reduction technique for flip chip package technology
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机译:当前用于倒装芯片封装技术的拥挤减少技术
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摘要
A current crowding reduction technique involving the uniform displacement of vias around a bump is provided. By uniformly arranging vias around the bump on an integrated circuit, current can uniformly flow to and from the bump, effectively leading to reduced current density around the bump. Further, a method for reducing current crowding around a bump using an uniform arrangement of vias around the bump is provided.
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