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Method of fabricating metal oxide semiconductor transistor with lightly doped impurity regions formed after removing spacers used for defining higher density impurity regions

机译:具有在去除用于限定较高密度杂质区域的间隔物之后形成的具有轻掺杂杂质区域的金属氧化物半导体晶体管的制造方法

摘要

In a method of fabricating a metal oxide semiconductor (MOS) transistor with a lightly doped drain (LDD) structure without spacers, gate electrodes and spacers are formed on a semiconductor substrate. A high density source/drain region is formed using the gate electrodes and the spacers as masks. A low density source/drain region is formed after removing the spacers. It is possible to reduce the thermal stress of the low density source/drain region by forming the high density source/drain region before the low density source/drain region is formed and to increase an area, in which suicide is formed, by forming a structure without spacers. Also, it is possible to simplify processes of fabricating a complementary metal oxide semiconductor (CMOS) LDD transistor by reducing the number of photoresist pattern forming processes in the method.
机译:在具有不具有间隔物的轻掺杂漏极(LDD)结构的金属氧化物半导体(MOS)晶体管的制造方法中,栅电极和间隔物形成在半导体衬底上。使用栅电极和间隔物作为掩模来形成高密度的源/漏区。在去除间隔物之后,形成低密度的源极/漏极区域。通过在形成低密度源/漏区之前形成高密度源/漏区,可以降低低密度源/漏区的热应力,并通过形成硅化物来增加形成硅化物的面积。没有垫片的结构。另外,通过减少该方法中的光致抗蚀剂图案形成工艺的数量,可以简化制造互补金属氧化物半导体(CMOS)LDD晶体管的工艺。

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