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Tantalum chip capacitor with cut-grooved lead frame

机译:带有切槽式引线框架的钽片式电容器

摘要

A tantalum chip capacitor with a cut-grooved anode lead frame is disclosed. The cut-grooved lead frame is designed to allow the tantalum element set in the small-sized epoxy mold package of the capacitor to have a desired size, thus restricting an increase in impedance of the tantalum chip capacitor regardless of a reduction in the size of the package according to the recent trend of smallness of the tantalum chip capacitors. This tantalum chip capacitor has a tantalum element, a anode lead wire extending from the tantalum element, and a cathode lead frame attached at its inside end to the tantalum element and forming a mounting terminal at its outside end. The cut-grooved anode lead frame is welded at its inside end to the lead wire while overlapping a part of the lead wire at the inside end having the cut groove. This anode lead frame also forms a mounting terminal at its outside end. A mold package encloses the tantalum element, the lead wire, a part of the cathode lead frame attached to the tantalum element, and a part of the anode lead frame welded to the lead wire.
机译:公开了一种具有切槽阳极引线框架的钽片电容器。切槽式引线框架设计为允许将电容器中的钽元件放置在电容器的小型环氧模制封装中,从而使钽片式电容器的阻抗增大,而无需减小电容器的尺寸。根据钽芯片电容器的小型化趋势来封装。该钽片电容器具有钽元件,从钽元件延伸的阳极引线,以及在其内端附接到钽元件并在其外端形成安装端子的阴极引线框架。切槽的阳极引线框架在其内端焊接到引线,同时在具有切槽的内端重叠一部分引线。该阳极引线框架还在其外端形成安装端子。模具封装件包围钽元件,引线,连接到钽元件的阴极引线框架的一部分以及焊接到引线的阳极引线框架的一部分。

著录项

  • 公开/公告号US6512668B1

    专利类型

  • 公开/公告日2003-01-28

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRO-MECHANICS CO. LTD.;

    申请/专利号US20020076309

  • 发明设计人 HYUN SUB OH;JAE KWANG KIM;

    申请日2002-02-19

  • 分类号H01G90/42;

  • 国家 US

  • 入库时间 2022-08-22 00:04:47

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