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Determining local thickness of layer in stack of layers in grooved optical disk, e.g. for CD-RW production, by performing measurements at at least as many different wavelengths as there are layers to be measured
Determining local thickness of layer in stack of layers in grooved optical disk, e.g. for CD-RW production, by performing measurements at at least as many different wavelengths as there are layers to be measured
A measuring light beam (15) is directed at an angle of incidence between 0 and 20 degrees onto the stack (11), and the thickness of the layer is determined from the intensity light transmitted and/or reflected in zero order and at least one further diffraction order. To determine the thicknesses of adjacent layers (12,13,14) arranged between a substrate (27) and a protective layer (28), measurement is performed at at least as many different wavelengths as there are layers to be measured. An Independent claim is also included for a measuring device.
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