Process for thinning a wafer structure for chip cards comprises embedding wafer into a support material with a liquid phase in an edge region, converting support material into a support material with a liquid phase and thinning wafer

摘要

Process for thinning a wafer structure comprises embedding the wafer into a support material (SM) with a liquid phase in an edge region (RB), converting the support material into a support material with a liquid phase and thinning the wafer to form an ultra-thin product wafer. An Independent claim is also included for a process for producing a semiconductor component structured on both sides.