首页> 外国专利> Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps

Production of conducting pathways on a substrate e.g. in microelectronics comprises applying a defined conducting adhesive on the substrate, partially hardening and repeating the previous steps

机译:在基底上产生导电路径,例如微电子学领域的研究包括在基板上施加确定的导电粘合剂,部分硬化并重复之前的步骤

摘要

Production of conducting pathways on a substrate comprises applying a defined conducting adhesive on the substrate; partially hardening; and repeating the previous steps. An Independent claim is also included for a device for producing conducting pathways on a substrate (1) comprising a dispensing arrangement (5) for structuring and applying the conducting adhesive (7) on the substrate, and a hardening arrangement (8) for hardening the adhesive.
机译:在基板上产生导电路径的步骤包括在基板上施加限定的导电粘合剂;以及在基板上施加导电粘合剂。部分硬化;并重复前面的步骤。还包括用于在基板(1)上产生导电路径的装置的独立权利要求,该装置包括用于在基板上构造和施加导电粘合剂(7)的分配装置(5)以及用于使基板硬化的硬化装置(8)。胶粘剂。

著录项

  • 公开/公告号DE10206437A1

    专利类型

  • 公开/公告日2002-11-14

    原文格式PDF

  • 申请/专利权人 ISA CONDUCTIVE MICROSYSTEMS GMBH;

    申请/专利号DE20021006437

  • 发明设计人 MEINEN TOMAS;

    申请日2002-02-15

  • 分类号H05K1/11;H05K3/00;H01L21/60;H01L21/768;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:14

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