Process for assembling and soldering a printed circuit board, reflow oven and printed circuit board for such a process

摘要

The invention relates to a method for assembling and soldering a printed circuit board which is equipped with a wired electrical component with at least one connecting wire or pin and one or one thermally critical housing or casing for conventional automatic soldering methods. The invention further relates to a reflow oven for soldering the circuit board and a circuit board for the method mentioned. DOLLAR A The invention enables the thermally critical component to be soldered in the reflow oven by using the printed circuit board itself to thermally shield the thermally critical THT components from the thermal energy acting on the printed circuit board and required for the soldering. For this purpose, the printed circuit boards 66 are placed, for example, on frames 67 and transported through the reflow oven 60 in such a way that the thermally critical components are arranged on the underside of the printed circuit boards 66 facing away from the thermal energy.