Structure for carrying off heat in a circuit board has a heat-conductive base board with an insulating heat-conductive layer to support contact connection surfaces that never interconnect.

摘要

A thin 6mm aluminum heat-conductive base plate (11) is covered by an insulating heat-conductive layer (IHCL) (12). Thin tin layers act as contact connection surfaces (14) that are applied to the IHCL with silk screen process printing and never interlink. A single-/multi-layer circuit board (21) has electronic components (22) on one of its sides and heat-conducting copper zones on the other side.